Singapore, 13 April 2015 – Invengo Technology, one of the worlds leading RFID companies, today announced the launch of their RAIN-RFID Inlays and Labels with the new UCODE 7 chip from NXP.
Invengo Technology today announced the release of their popular RAIN RFID Inlays and Labels using the new NXP UCODE 7 silicon, offering outstanding performance for RAIN RFID applications for shoes and apparel.
NXP has engineered the UCODE 7 to allow smaller antennas to be used without sacrificing read distance, enabling smaller retail swing tags and labels. The chips also support the high speed encoding necessary to sustain volume manufacturing.
''NXP has created a product that addresses many issues for inlay manufacturers like Invengo and service bureaus looking for bulk or faster encoding of RAIN RFID tags and labels'', stated Scott Medford, Chief Sales Officer at Invengo.
Ralf Kodritsch, RAIN-RFID Business Segment Manager from NXP commented that UCODE7 in combination with the high-performing Invengo antenna ensures advantages along the whole supply chain, from encoding to stock taking, providing retailers with higher levels of item visibility which subsequently improves our shopping experience.
More information on the new Invengo inlays and labels with UCODE 7 products will be exhibited at this week's RFID Journal event in San Diego, Calif., USA.
ABOUT INVENGO TECHNOLOGY
Invengo – a global RFID technology provider – is a leading designer and manufacturer of high-quality, innovative UHF and NFC RFID inlays, tags and solutions accompanied by an extensive RFID product offering used in applications such as Apparel, Books, Library, Asset Tracking, Case and Pallet Tracking, Transport, and Health Care.
Invengo Technology, located in Singapore (with local subsidiaries in the US and Europe), is the International Headquarters of Invengo Information Technology Ltd which is listed on the Shenzhen Stock Exchange, China (SZSE: 002161.SZ) and holds a market cap of over $800 Million. Invengo employs over 450 people worldwide, with design and manufacturing plants located in both the United States and China.
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